PMLL4148L,115 NXP Semiconductors, PMLL4148L,115 Datasheet
PMLL4148L,115
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933930220115
PMLL4148L T/R
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PMLL4148L,115 Summary of contents
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PMLL4148L; PMLL4448 High-speed switching diodes Rev. 8 — 1 February 2011 1. Product profile 1.1 General description Single high-speed switching diodes, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. Table 1. Type ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin 1 2 [1] The marking band indicates the cathode. 3. Ordering information Table 4. Type number PMLL4148L PMLL4448 4. Marking Table 5. Type number PMLL4148L PMLL4448 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint °C prior to surge. [ Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 300 I F (mA) 200 100 0 0 100 FR4 PCB, standard footprint Fig 1. Forward current as a function of ambient temperature; derating curve FSM ( − Based on square wave currents °C; prior to surge T j Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values ...
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... NXP Semiconductors = 25 ° MHz Fig 5. Diode capacitance as a function of reverse voltage; typical values 8. Test information D.U.T. I Ω × ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω ...
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... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMLL4148L PMLL4448 [1] For further information and the availability of packing methods, see PMLL4148L_PMLL4448 Product data sheet PMLL4148L; PMLL4448 0.3 3 ...
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... NXP Semiconductors 11. Soldering Fig 9. 2.90 Fig 10. Wave soldering footprint SOD80C PMLL4148L_PMLL4448 Product data sheet PMLL4148L; PMLL4448 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 All information provided in this document is subject to legal disclaimers. Rev. 8 — 1 February 2011 ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PMLL4148L_PMLL4448 v.8 20110201 • Modifications: • • PMLL4148L_PMLL4448 v.7 20070131 PMLL4148L_PMLL4448 v.6 20050404 PMLL4148L_4448 v.5 20020123 PMLL4148L_4448 v.4 20001115 PMLL4148 v.3 19990527 PMLL4148 v.2 19960918 PMLL4148 v.1 19960423 PMLL4148L_PMLL4448 Product data sheet ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...