INTRODUCTION
is possible with the EK54 evaluation kit. The EK54 includes
both the universal EVAL36 board and the EVAL46 substrate.
The use of EVAL36 and EVAL46 allows for a large area of
breadboarding space to work with while allowing a surface
mount substrate for the PA60DK. The PA60DK amplifi er
may be surface mounted directly to the EVAL46, a thermally
conductive but electrically isolated substrate. The PA60DK
is soldered to a DUT foil footprint area the size of the
heatslug as shown in Figure 1. The metal substrate is cost
effective and can allow the PA60DK to dissipate power up
to the datasheet rating.
Part#
EVAL36
EVAL46
TSM-116-01-T-SV
SSW-116-01-T-S
PCE2055CT-ND
OX7R105KWN
*031606
* Parts are not supplied. Parts are application dependant.
Suggested part numbers are provided.
Figure 1
M I C R O T E C H N O L O G Y
2.000
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
.000
Fast and easy breadboarding of circuits using the PA60DK
+INB
+INA
-INA
-INB
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
EVAL46 TOP
J1
Description
Universal PC Board
Evaluation substrate, PA60DK
Terminal Strip, 16 PIN
Socket Strip, 16 PIN
CAP, 47uF, 50V
Cap, 200V, 1uF, Ceramic
5V, 10mA, 3.4°C/W
heatsink with fan, AAVID
M
EVAL46 rev A
EK54
I
C
R
O
+IN(A)
+IN(B)
-IN(A)
-IN(B)
T
-VS
NC
NC
NC
NC
NC
E
C
10
H
1
H T T P : / / W W W . A P E X M I C R O T E C H . C O M
N
O
L
O
DUT
G
Y
2 PLACES
C4
C2
C3
20
11
Ø0.120
Quantity
C1
-VS
NC
OUT(A)
NC
+VS
+VS
NC
OUT(B)
NC
NC
EVALUATION KIT FOR PA60DK
1
1
2
2
2
2
1
BEFORE YOU GET STARTED
• All Apex amplifiers should be handled using ESD
• Review the Apex product datasheet and operating
• Always provide the appropriate heat sinking. Power
• Always use adequate power supply bypass capacitors,
• Do not change connections while the circuit is powered
• In case -Vs is disconnected before +Vs, a diode between
• Initially set all power supplies to the minimum operating
• Check for oscillations up to and above the unity gain
ASSEMBLY
assembled to the EVAL46 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA60DK
provides maximum heat dissipation capabilities when soldered
to the foil footprint area. The PA60DK should be refl owed to the
substrate using a solder refl ow furnace. If this is not available,
The PA60DK is a surface mount device and should be
EK54
J2
precaution.
conditions.
dissipation must be considered to ensure maximum
junction temperature (T
Apex recommends at least 10µF per amp of output
current.
-Vs and ground is recommended to avoid damage.
levels allowed in the product datasheet.
bandwidth of the amplifi er.
( 8 0 0 ) 5 4 6 - A P E X
GND A
GND A
NC
-VS
NC
NC
NC
NC
VOA
NC
VOB
NC
+VS
NC
GND B
GND B
.175
a heat plate capable of solder refl ow
temperatures may be used.
top of the substrate, the heat sink fan or
selected heat sink can then be mounted
to the back of the substrate. A heat
sink is not supplied with the kit, but
several options are available through
AAVID Thermal Product, Inc. High thermal
conductive thermal grease should be
used when mounting the heat sink fan or
heat sink to the evaluation board.
possible assembly methods to construct
this evaluation kit.
Once the amplifi er is mounted on the
Review Figure 2 on next page for other
J
) is not exceeded.
( 8 0 0 ) 5 4 6 - 2 7 3 9
1