STEVAL-ISA037V1 STMicroelectronics, STEVAL-ISA037V1 Datasheet - Page 17

• Manufacturer Part Number: STEVAL-ISA037V1
• Description: BOARD EVAL BASED ON L6728
• Manufacturer: STMicroelectronics
• Type: DC/DC Switching Converters, Regulators & Controllersr

Specifications of STEVAL-ISA037V1

• Design Resources: STEVAL-ISA037V1 Gerber Files STEVAL-ISA037V1 Schematic STEVAL-ISA037V1 Bill of Material
• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 1.25V
• Current - Output: 20A
• Voltage - Input: 5 ~ 12V
• Regulator Topology: Buck
• Frequency - Switching: 300kHz
• Board Type: Fully Populated
• Utilized Ic / Part: L6728
• Input Voltage: 5 V to 12 V
• Output Voltage: 1.25 V
• Product: Power Management Modules
• Silicon Manufacturer: ST Micro
• Silicon Core Number: L6728
• Kit Application Type: Power Management - Voltage Regulator
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: L6728
• Other names: 497-6418; STEVAL-ISA037V1

L6728
10.2
Layout guidelines
L6728 provides control functions and high current integrated drivers to implement high-
current step-down DC-DC converters. In this kind of application, a good layout is very
important.
The first priority when placing components for these applications has to be reserved to the
power section, minimizing the length of each connection and loop as much as possible. To
minimize noise and voltage spikes (EMI and losses) power connections (highlighted in
Figure
traces: loop must be anyway minimized. The critical components, i.e. the power MOSFETs,
must be close one to the other. The use of multi-layer printed circuit board is recommended.
The input capacitance (C
placed close to the power section in order to eliminate the stray inductance generated by the
copper traces. Low ESR and ESL capacitors are preferred, MLCC are suggested to be
connected near the HS drain.
Use proper VIAs number when power traces have to move between different planes on the
PCB in order to reduce both parasitic resistance and inductance. Moreover, reproducing the
same high-current trace on more than one PCB layer will reduce the parasitic resistance
associated to that connection.
Connect output bulk capacitors (C
inductance and resistance associated to the copper trace, also adding extra decoupling
capacitors along the way to the load when this results in being far from the bulk capacitors
bank.
b)
c)
d)
e)
f)
7) must be a part of a power plane and anyway realized by wide and thick copper
Place F
Place F
Place F
Check that compensation network gain is lower than open loop EA gain before
F
Check phase margin obtained (it should be greater than 45°) and repeat if
necessary.
C
R
C
C
0dB
P
S
S
F
=
=
=
=
;
----------------------------------------------------------
2π R
-------------------------- -
------------------------------ -
π R
----------------- - 1
2 F
-----------------------------
π R
F
Z1
P1
Z2
⋅
⋅
⋅
SW
R
⋅
LC
S
below F
at F
FB
at F
F
1
1
F
⋅
⋅
–
F
⋅
F
C
SW
LC
ESR
LC
C
F
IN
F
⋅
and F
), or at least a portion of the total capacitance needed, has to be
F
:
LC
ESR
(typically 0.5*F
P2
–
OUT
1
at half of the switching frequency:
) as near as possible to the load, minimizing parasitic
LC
):
Application details
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