HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 468

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 12 Bus State Controller (BSC)
Rev. 1.00 Dec. 27, 2005 Page 424 of 932
REJ09B0269-0100
Figure 12.20 Burst Read Timing (Bank Active, Same Row Address)
A12/A11*
A25 to A0
D31 to D0
DACKn*
RD/WR
DQMxx
Notes:
CKIO
RAS
CAS
CSn
BS
1
2
1. Address pin to be connected to the A10 pin of SDRAM.
2. The waveform for DACKn is when active low is specified.
Tnop
Tc1
Td1
Tc2
Td2
Tc3
Td3
Tc4
Td4
Tde

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