HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 960

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
24.4
A graph (reference data) of the variation in delay time when a load capacitance greater than that
stipulated (30 pF) is connected to this LSI’s pins is shown below. The graph shown in Figure
24.76 should be taken into consideration in the design process if the stipulated capacitance is
exceeded in connecting an external device.
If the connected load capacitance exceeds the range shown in Figure 24.76, the graph will not be a
straight line.
Rev. 1.00 Dec. 27, 2005 Page 916 of 932
REJ09B0269-0100
Delay Time Variation Due to Load Capacitance
Figure 24.76 Load Capacitance vs. Delay Time
+4.0 ns
+3.0 ns
+2.0 ns
+1.0 ns
+0.0 ns
+0 pF
Load Capacitance [pF]
+25 pF
+50 pF

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