HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 469

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
D31 to D0
A12/A11*
A25 to A0
RD/WR
DQMxx
DACKn*
RAS
CAS
CSn
Figure 12.21 Burst Read Timing (Bank Active, Different Row Addresses)
BS
CKIO
1
2
Notes: 1. Address pin to be connected to the A10 pin of SDRAM.
Tp
2. The waveform for DACKn is when active low is specified.
Tpw
Tr
Tc1
Tc2
Td1
Tc3
Td2
Rev. 1.00 Dec. 27, 2005 Page 425 of 932
Section 12 Bus State Controller (BSC)
Tc4
Td3
Td4
REJ09B0269-0100
Tde

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