HD6417712BPV Renesas Electronics America, HD6417712BPV Datasheet - Page 527

MPU 1.5/3.3V 0K PB-FREE 256-BGA

HD6417712BPV

Manufacturer Part Number
HD6417712BPV
Description
MPU 1.5/3.3V 0K PB-FREE 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH Ethernetr
Datasheet

Specifications of HD6417712BPV

Core Processor
SH-3 DSP
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, Ethernet, FIFO, SCI, SIO
Peripherals
DMA, POR, WDT
Number Of I /o
24
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417712BPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figure 13.6 shows an example of DMA transfer timing in dual address mode.
Auto request, external request, and on-chip peripheral module request are available for the
transfer request. DACK can be output in read cycle or write cycle in dual address mode. The
AM bit of the channel control register (CHCR) can specify whether the DACK is output in
read cycle or write cycle.
The SAR value is an address, data is read from the transfer source module,
and the data is temporarily stored in the DMAC.
The DAR value is an address and the value stored in the data buffer in the
DMAC is written to the transfer destination module.
Data buffer
Data buffer
Figure 13.5 Data Flow in Dual Address Mode
DMAC
DMAC
SAR
DAR
SAR
DAR
Second bus cycle
First bus cycle
Section 13 Direct Memory Access Controller (DMAC)
Transfer destination
Transfer destination
Transfer source
Transfer source
Memory
Memory
module
module
module
module
Rev. 1.00 Dec. 27, 2005 Page 483 of 932
REJ09B0269-0100

Related parts for HD6417712BPV